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Basic Theory and Microscopic Research of Copper Foil
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The performance of electrolytic copper foil is affected by its own crystal structure. Through the rational regulation of additives in the electrolysis process, the reaction potential of copper deposition can be changed, thus influencing the microstructure and morphology of the copper foil. Through decades of technological accumulation, Defu Technology has focused on and made breakthroughs in key projects such as the physical property correlation of microscopic grain characteristics, the research on material stress and elastic modulus characteristics, and the theoretical model of copper foil roughness.
Ultra-fine roughening
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In response to the development trend of thinner and lighter PCB boards and the low transmission loss characteristics of high-frequency and high-speed circuits, polymer additives have been developed to achieve the purpose of customized design of copper nodules on the copper foil surface. This technology also takes into account low roughness and sufficient peel strength, making it the key to copper foil manufacturing technology.
Low - Ferromagnetic Barrier Layer
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In the metal barrier layer of copper foil for electronic circuits, there are factors that hinder signal transmission, and such effects will be further amplified in high-speed PCBs. In response to this phenomenon, a low-ferromagnetic metal barrier layer has been developed, which reduces the loss during signal transmission to a certain extent.
Silane coupling agent
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According to customer needs, we specifically developed the adaptation technology for silane coupling agents, which improved the chemical bonding performance between copper foil and various high - frequency and high - speed resin substrates.